Wiring board incorporating components and process for producing the same

A manufacturing method of a component built-in wiring board, comprising:

• producing a core wiring board having conductive layers on at least an upper and a lower surface thereof respectively;
• forming a through hole in the produced core wiring board;
• forming a conductive layer so as to include an inner surface of the formed through hole;
• patterning the conductive layers provided on the upper and lower surfaces;
• machining the produced core wiring board so as to split the conductive layer formed in the through hole according to the number of terminals of an electrical/electronic component that is to be built and so as to make a space for housing the electrical/electronic component that is to be built in;
• placing the electrical/electronic component in the space;
• connecting each of the terminals of the placed electrical/electronic component to the split conductive layer via a conductive member;
• and
• forming and stacking insulating layers respectively on the upper and lower surfaces of the core wiring board to which the electrical/electronic component is connected via the conductive member, so as to fill a vicinity of the electrical/electronic component.

A manufacturing method of a component built-in wiring board, comprising:

• producing a core wiring board having conductive layers on at least an upper and a lower surface thereof respectively;
• forming a through hole in the produced core wiring board so as to make a space for housing an electrical/electronic component that is to be built in;
• forming a conductive layer so as to include an inner surface of the formed through hole;
• patterning the conductive layers provided on the upper and lower surfaces;
• splitting the conductive layer formed in the through hole according to the number of terminals of the electrical/electronic component that is to be built in;
• placing the electrical/electronic component in the space;
• connecting each of the terminals of the placed electrical/electronic component to the split conductive layer via a conductive member;
• and
• forming and stacking insulating layers respectively on the upper and lower surfaces of the core wiring board to which the electrical/electronic component is connected via the conductive member, so as to fill a vicinity of the electrical/electronic component.