US 2006/0154485 A1 · Sacrificial layers comprising water-soluble compounds, uses and methods of production thereof

Abstract

Sacrificial composition and/or coating materials contemplated herein for use in semiconductor and electronic applications comprise at least one water-soluble compound and/or at least one water-soluble compound precursor and at least one solvent. Sacrificial materials and/or compositions may be produced by a method, comprising: a) providing at least one water-soluble compound and/or at least one water-soluble compound precursor, b) providing at least one solvent and c) blending the at least one water-soluble compound and/or precursor with the at least one solvent to form the sacrificial material and/or composition.

Claims24

Dependent claims

A sacrificial composition, comprising:

at least one water-soluble compound, and
at least one solvent.

Dependencies are inferred from the claim text.

Facts

Application

11/033,798Filed 12 Jan 2005

Published

13 Jul 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

H10P 14/683
Organic materials, e.g. photoresists: carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
H10W 20/085
For dual-damascene structures: involving intermediate temporary filling with material
H10P 14/6342
Deposition processes: liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
H10P 14/6922
Containing silicon: the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC

Sacrificial layers comprising water-soluble compounds, uses and methods of production thereof

Life of this patent

Sacrificial layers comprising water-soluble compounds, uses and methods of production thereof

Life of this patent

Abstract

Claims24