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US 2006/0154444 A1Published application
Method of forming wiring
AssigneeSony Corporation
InventorsYoshiyuki Yanagisawa, Toshiaki Iwafuchi
Life of this patent
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Abstract
A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating layer is irradiated with a laser beam with the focus position staggered.
Claims4
A method of forming a wiring, comprising:
- forming an insulating layer on a first wiring layer;
- forming an opening portion in the insulating layer by irradiation of the insulating layer with a laser beam having a staggered focus position,
- wherein the irradiation with the laser beam is so conducted that a side wall of the opening portion is inclined by not less than about 20 degrees relative to the vertical direction;
- and
- forming a second wiring layer directly on at least the side wall of the insulting layer.
2 more elements
Dependencies are inferred from the claim text.