Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate

A method of making a capacitive substrate having first and second capacitors therein, said method comprising:

• providing first and second conductive layers;
• providing first and second capacitive dielectric layers each having first and second opposing sides;
• bonding said first opposing side of said first capacitive dielectric layer to said first conductive layer and said first opposing side of said second capacitive dielectric layer to said second conductive layer;
• forming at least one first conductor on each of said second opposing sides of said first and second capacitive dielectric layers, respectively;
• forming an electrical connection through each of said first and second capacitive dielectric layers to said at least one first conductor on each of said second opposing sides of said first and second capacitive dielectric layers, respectively;
• and
• forming at least one second conductor from each of said first and second conductive layers, respectively, each of said at least one second conductors not being electrically connected to the corresponding one of said at least one first conductors and said electrical connections through said capacitive dielectric layers, each of said at least one first and second conductors on said first and second capacitive dielectric layers serving as capacitor electrodes for a single capacitor when said conductors are electrically coupled to other circuit structure and said circuit structure is operational.

A method of making a circuitized substrate having a capacitive substrate therein, said method comprising:

• providing a conductive layer;
• providing a capacitive dielectric layer having first and second opposing sides;
• bonding said first opposing side of said capacitive dielectric layer to said conductive layer;
• forming at least one first conductor on said second opposing side of said capacitive dielectric layer;
• forming an electrical connection through said capacitive dielectric layer to said at least one first conductor;
• forming at least one second conductor from said conductive layer, said at least one second conductor not being electrically connected to said at least one first conductor and said electrical connection through said capacitive dielectric layer;
• forming a dielectric layer on said capacitive dielectric layer over said at least one second conductor and said electrical connection;
• forming third and fourth conductors on said dielectric layer;
• and
• electrically coupling said third conductor to said at least one first conductor and said fourth conductor to said electrical connection to form an electrical circuit including said at least one first and second conductors, said third and fourth conductors and said electrical connection, each of said at least one first and second conductors serving as capacitor electrodes of a capacitor within said electrical circuit when said electrical circuit is operational.

A method of making a circutized substrate having a capacitive substrate therein including first and second capacitors, said method comprising:

• providing first and second conductive layers;
• providing first and second capacitive dielectric layers each having first and second opposing sides;
• bonding said first opposing side of said first capacitive dielectric layer to said first conductive layer and said first opposing side of said second capacitive dielectric layer to said second conductive layer;
• forming at least one first conductor on each of said second opposing sides of said first and second capacitive dielectric layers, respectively;
• forming first and second electrical connections through said first and second capacitive dielectric layers, respectively, to said at least one first conductor on each of said second opposing sides of said first and second capacitive dielectric layers, respectively;
• forming at least one second conductor from each of said first and second conductive layers, respectively, each of said at least one second conductors not being electrically connected to the corresponding one of said at least one first conductors and said electrical connections through said capacitive dielectric layers;
• forming a dielectric layer on each of said capacitive dielectric layers over each of said at least one second conductors and said electrical connections, respectively;
• forming third and fourth conductors on one of said dielectric layers, and fifth and sixth conductors on a second of said dielectric layers, respectively;
• electrically coupling said third conductor to one of said at least one first conductors and said fourth conductor to said first electrical connection to form a first electrical circuit including said at least one first and second conductors, said third and fourth conductors and said first electrical connection, each of said at least one first and second conductors serving as capacitor electrodes of a first capacitor within said electrical circuit when said first electrical circuit is operational;
• and
• electrically coupling said fifth conductor to one of said at least one first conductors and said sixth conductor to said second electrical connection to form a second electrical circuit including said at least one first and second conductors, said fifth and sixth conductors and said second electrical connection, each of said at least one first and second conductors serving as capacitor electrodes of a second capacitor within said second electrical circuit when said second electrical circuit is operational.