Polyimide-copper composite laminate
AssigneeUbe Industries, Ltd.
InventorsHiroto Shimokawa, Kohji Narui, Toshinori Hosoma, Toshihiko Anno
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Abstract
A polyimide-copper composite laminate is composed of a metallic carrier having a thickness of 10-35 μm and a thin copper film having a thickness of 1-8 μm, and an intervening heat-resistant layer and an aromatic polyimide film directly fixed to the thin copper film without adhesive.
Claims13
A polyimide-copper composite laminate comprising a metallic carrier having a thickness in the range of 10 to 35 μm and a thin copper film having a thickness in the range of 1 to 8 μm, and an intervening heat-resistant layer placed between the metallic carrier and the thin copper film and an aromatic polyimide film directly fixed to the thin copper film without adhesive.
Dependencies are inferred from the claim text.