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US 2006/0151865 A1Published application
Semiconductor chip stack package having dummy chip
OwnerChang-Hoon Han, Sang-Ho Aninventors
Life of this patent
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Abstract
A chip stack package may have a circuit substrate, a first IC chip provided on the circuit substrate, and a second IC chip provided on the first IC chip. The second IC chip may be larger in size than the first IC chip and have overhang portions that may extend beyond edges of the first IC chip. At least one dummy chip may be provided on the second IC chip and cover the edges of the first IC chip. The dummy chip may include a single chip or a plurality of chips.
Claims20
A package comprising:
- a circuit substrate;
- a first IC chip provided on the circuit substrate using a first adhesive layer and electrically connected to the circuit substrate;
- a second IC chip being larger in size than the first IC chip, the second IC chip provided on the first IC chip using a second adhesive layer and electrically connected to the circuit substrate using a second bonding wire;
- and
- at least one dummy chip being smaller in size than the second IC chip, the dummy chip provided on the second IC chip using a third adhesive layer;
- wherein the second IC chip has overhang portions that extend beyond edges of the first IC chip;
- and
- wherein the dummy chip covers the edges of the first IC chip.
5 more elements
A package comprising:
- a first IC chip;
- a second IC chip provided on the first IC chip, the second IC chip having an overhang portion that extends beyond an edge of the first IC chip;
- and
- at least one dummy chip provided on the second IC chip, the at least one dummy chip superposed over the edge of the first IC chip.
1 more element
A method of manufacturing a package, the method comprising:
- providing a first IC chip;
- providing a second IC chip on the first IC chip so that an overhang portion of the second IC chip extends beyond an edge of the first IC chip;
- and
- providing at least one dummy chip on the second IC chip so that the at least one dummy chip superposes over an edge of the first IC chip.
1 more element
Dependencies are inferred from the claim text.