Image sensor device and method of manufacturing same

A method of manufacturing an image sensor device comprising:

• preparing a wafer having a plurality of image sensor chips formed on an active surface, wherein each image sensor chip includes chip pads formed in a peripheral region, a microlens formed in a central region and an intermediate region between the peripheral and central regions;
• preparing a protective plate having an adhesive pattern corresponding to the intermediate regions of the image sensor chips;
• attaching the protective plate to the active surface of the wafer with the adhesive pattern while maintaining a separation distance between the protective plate and the microlens;
• forming connection holes through the wafer from a back surface of the wafer to expose a portion of the lower surface of the chip pads;
• forming conductive plugs in the connection holes to establish electrical connections to the chip pads, the conductive plugs extending from the chip pads to the back surface of the wafer;
• forming solder balls on the back surface of the wafer and in electrical contact with the conductive plugs;
• and
• separating individual image sensor chips and corresponding individual protective plates from the wafer.

A method of manufacturing an image sensor device comprising:

• preparing a wafer having an active surface and a back surface opposite the active surface with chip areas and scribe lines formed between adjacent chip areas on the active surface;
• forming connection holes extending from the active surface into the wafer;
• forming conductive plugs in the connection holes;
• forming chip pads in a peripheral region of the chip area, a microlens in a central region of the chip area and an intermediate region of the chip area between the peripheral and central regions;
• attaching a protective plate to the intermediate regions of the chip area with an adhesive pattern while maintaining a separation distance between the protective plate and the microlens;
• removing a portion of the back surface of the wafer to expose lower surfaces of the conductive plugs;
• forming solder balls on the exposed lower surfaces of the conductive plugs;
• and
• separating the wafer along the scribe lines into individual image sensor devices including corresponding individual protective plates.