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US 2006/0141804 A1Published application
Method and apparatus to facilitate electrostatic discharge resiliency
OwnerCathryn Goodman, Dean Banwart +2inventors
InventorsCathryn Goodman, Dean Banwart, Miles Jackson, Mark Lill
Life of this patent
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Abstract
A circuit element (such as an asperity sensor circuit (11)) as is formed (21) using semiconductor fabrication processing has a high resistance layer formed (22) thereover. The high resistance layer is preferably formed using semiconductor fabrication processing. The high resistance layer can be comprised of a variety of materials and can assume a wide variety of configurations.
Claims19
A method to improve electrostatic discharge resiliency for a circuit element, comprising:
- providing a circuit element using semiconductor fabrication processing;
- forming, using semiconductor fabrication processing, a high resistance layer over the circuit element to thereby protect the circuit element from externally sourced electrostatic discharge.
A semiconductor apparatus comprising:
- a circuit element formed using semiconductor fabrication processing;
- a high resistance layer that is formed using semiconductor fabrication processing and that is disposed between the circuit element and an exterior to thereby protect the circuit element from externally sourced electrostatic discharge.
Dependencies are inferred from the claim text.