Back to results
US 2006/0141798 A1Published application
Device and method of performing a seasoning process for a semiconductor device manufacturing apparatus
AssigneeDongbuAnam Semiconductor Inc.
InventorBo-Yeoun Jo
Life of this patent
Estimating the term…
Abstract
A method of performing a seasoning process for a semiconductor device processing apparatus is provided by the present invention. The method includes: forming a material layer on a test wafer; coating a photoresist on the material layer; patterning the photoresist so as to expose a central region of the wafer and cover an edge region thereof; and etching the material layer exposed by the photoresist pattern.
Claims20
A method of patterning a test wafer, comprising:
- forming a material layer on a test wafer;
- coating a photoresist on the material layer;
- and
- patterning the photoresist so as to expose a central region of the wafer and cover an edge region thereof.
1 more element
A method of seasoning a semiconductor process chamber or apparatus, comprising:
- forming a material layer on a test wafer;
- coating a photoresist on the material layer;
- patterning the photoresist so as to expose a central region of the wafer and to cover an edge region thereof;
- and
- etching the material layer exposed by the photoresist pattern.
2 more elements
Dependencies are inferred from the claim text.