Method for producing an electrical component
Assigneeaustriamicrosystems AG
InventorsManfred Brandl, Robert Csernicska, Walter Draxler
Life of this patent
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Abstract
To expose a submerged bondable terminal pad in a component that includes at least two substrates which are joined with each other, it is proposed that grooves of relatively shallow depth be provided on the connecting surface of the second substrate before the two substrates are joined. After the two substrates are joined, incisions are made opposite the grooves which open the grooves from the back side. The cutouts to be removed are defined between two grooves.
Claims20
A method of producing a component comprised of at least first and second substrates, the first substrate having an upper surface that contains terminal pads, and the first substrate comprising component structures that are electrically conductive and that are electrically connected to the terminal pads, the second substrate having a lower surface that faces the upper surface of the first substrate, the method comprising:
- forming grooves having a predefined depth on the lower surface of the second substrate;
- forming incisions on an upper surface of the second substrate, the incisions reaching the grooves to form a cutout portion in the second substrate;
- and
- removing the cutout portion to expose the terminal pads.
A method of producing a component comprised of first and second substrates that are joined via an upper surface of the first substrate and a lower surface of the second substrate, the upper surface of the first substrate containing terminal pads, and the first substrate comprising component structures that are electrically conductive and that are electrically connected to the terminal pads, the method comprising:
- forming grooves having a predefined depth on the lower surface of the second substrate, the grooves being formed in substantially straight lines via a first formation technique, a pair of the grooves defining a strip-shaped cutout portion of the second substrate;
- joining the upper surface of the first substrate and the lower surface of the second substrate;
- forming incisions on an upper surface of the second substrate via a second formation technique, the incisions reaching the grooves to separate the cutout portion from a remainder of the second substrate, the first formation technique differing from the second formation technique, and the first formation technique having greater precision than the second formation technique;
- and
- removing the cutout portion to expose the terminal pads.
Dependencies are inferred from the claim text.