Method for producing a semiconductor structure
AssigneeInfineon Technologies AG
InventorsWerner Graf, Lars Heineck, Jana Horst
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AssigneeInfineon Technologies AG
InventorsWerner Graf, Lars Heineck, Jana Horst
Estimating the term…
In a method for producing a semiconductor structure a semiconductor a substrate with a top surface is provided. A gate dielectric layer is provided on the top surface and on the gate dielectric layer is provided a memory cell array region with a first plurality of gate stacks and a peripheral element region with a second plurality of gate stacks. A dielectric layer is provided over the memory cell array region and the peripheral element region. A first source/drain implantation over the memory cell array region and the peripheral element region is carried out, a blocking mask over the memory cell array region is formed, the dielectric layer is removed using the blocking mask, and a second source/drain implantation over the memory cell array region and the peripheral element region is carried out, wherein the memory cell array region is protected by a mask.
A method for producing a semiconductor structure, comprising the steps of:
Dependencies are inferred from the claim text.