Method and system for wafer bonding of structured substrates for electro-mechanical devices

Abstract

A method for forming a composite substrate structure. The method includes providing a first substrate, the first substrate having a surface region and a backside region, providing a handling substrate, the handling substrate having a bonding surface and a handling surface, and activating at least one of the surface region of the first substrate and the bonding surface of the handling substrate using a surface activation process. The method also includes thereafter contacting the surface region of the first substrate to the bonding surface of the handling substrate to form a composite substrate structure, and thereafter applying a voltage to the backside region and the handling surface of the composite substrate structure. In one embodiment, the step of activating at least one of the surface region of the first substrate and the bonding surface of the handling substrate is performed in a plasma activation chamber.

Dependencies are inferred from the claim text.