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AssigneeLG Chem, Ltd.
InventorsGi Yi, Jong Kim, Jung Hee Lee, Jeong Jin Hong, Young Jun Hong, No Ma Kim, An Na Lee
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Disclosed is an adjuvant for use in simultaneous polishing of a cationically charged material and an anionically charged material, which forms a adsorption layer on the cationically charged material in order to increase the polishing selectivity of the anionically charged material to cationically charged material, wherein the adjuvant comprises a polyelectrolyte salt containing: (a) a graft type polyelectrolyte that has a weight average molecular weight of 1,000˜20,000 and comprises a backbone and a side chain; and (b) a basic material. CMP (chemical mechanical polishing) slurry comprising the above adjuvant and abrasive particles is also disclosed.
An adjuvant for use in simultaneous polishing of a cationically charged material and an anionically charged material, which forms a adsorption layer on the cationically charged material in order to increase polishing selectivity of the anionically charged material, wherein the adjuvant comprises a polyelectrolyte salt containing:
An adjuvant for CMP (chemical mechanical polishing) slurry, which comprises a polyelectrolyte salt containing:
A method for inhibiting a cationically charged material from being polished during a polishing process, which uses a polyelectrolyte salt containing:
Dependencies are inferred from the claim text.