Thermal interface structure with integrated liquid cooling and methods
AssigneeIntel Corporation
InventorsSabina Houle, James Matayabas
Life of this patent
Estimating the term…
Abstract
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.
Claims20
A method of cooling an integrated circuit die, comprising:
- conducting heat from a surface of an integrated circuit die into a metal seal structure located in a region between the surface of the integrated circuit die and a heat spreader;
- conducting heat from the surface of the integrated circuit die into an amount of liquid material contained within the region and within the metal seal structure;
- circulating the amount of liquid material.
A method of manufacturing an integrated circuit assembly, comprising:
- forming a perimeter seal portion;
- attaching the perimeter seal portion between an integrated circuit chip and a heat spreader wherein at least one interface of the perimeter seal portion is formed using cold forming techniques;
- and
- placing an amount of liquid material between the integrated circuit chip and the heat spreader within the perimeter seal portion.
A method of manufacturing an integrated circuit assembly, comprising:
- forming a metal perimeter seal portion;
- attaching the perimeter seal portion between an integrated circuit chip and a heat spreader wherein at least one interface of the perimeter seal portion is formed using cold forming techniques;
- placing an amount of liquid material between the integrated circuit chip and the heat spreader within the perimeter seal portion;
- and
- coupling a pump to the perimeter seal portion to circulate the amount of liquid material over the integrated circuit chip.
A method of manufacturing an integrated circuit assembly, comprising:
- forming a metal perimeter seal portion;
- attaching the perimeter seal portion between an integrated circuit chip and a heat spreader wherein at least one interface of the perimeter seal portion is formed using cold forming techniques;
- placing an amount of liquid material between the integrated circuit chip and the heat spreader within the perimeter seal portion;
- coupling a pump to the perimeter seal portion to circulate the amount of liquid material over the integrated circuit chip;
- and
- coupling a heat exchanger to the pump and the seal portion, wherein the heat exchanger is located apart from the integrated circuit chip.
Dependencies are inferred from the claim text.