Bare die socket
AssigneeTeradyne, Inc.
InventorsDonald Milbrand, Mark Gailus, Nathan Pascarella
Life of this patent
Estimating the term…
Abstract
A socket for removably mounting a bare die to a substrate, such as a printed circuit board. This socket is formed by insert molding signal conductors in an insulative housing. A ground structure is separately provided to control the impedance of the signal conductors and to reduce cross talk. The ground structure may be formed as a separate subassembly and attached to the subassembly formed by insert molding a housing around signal conductors. The ground structure also provides ground connections between the printed circuit board and the chip.
Claims24
A method of manufacturing a chip socket comprising:
- a) providing a plurality of conductive members, each having a first contact portion, a second contact portion and an intermediate portion coupled between the first contact portion and the second contact portion;
- b) molding insulative material over the intermediate portions of the plurality of conductive members, the insulative material shaped with a first surface and a second surface, opposite the first surface, the insulative material molded to leave the first contact portions of each of the plurality of conductive members exposed in the first surface of the insulative material and to leave the second contact portions of each of the plurality of conductive members exposed in the second surface of the insulative material.
A chip socket comprising:
- a) an insulative housing;
- and
- b) a plurality of conductive members, each having a first contact portion and a second contact portion and an intermediate portion coupled between the first contact portion and the second contact portion, wherein the plurality of conductive members are positioned with the intermediate portions of the plurality of conductive members disposed in a plane within the insulative housing and the first contact portion of each of the plurality of conductive members extending from the plane in a first direction and the second contact portion of each of the plurality of conductive members extending from the plane in a second direction, opposite the first direction.
A chip socket comprising:
- a) a plurality of conductive members, each of the plurality of conductive members having an first contact portion, a second contact portion and an intermediate portion coupled between the first contact portion and the second contact portion, with the intermediate portions of the plurality of conductive members disposed in a first plane with the first contact portion of each of the plurality of conductive members extending in a first direction and the second contact portion of each of the plurality of conductive members extending in a second direction;
- and
- b) a conductive structure having a portion positioned in a second plane parallel to the first plane, the conductive structure having a plurality of first contact portions and a plurality of second contact portions, with the plurality of first contact portions extending in the first direction and the plurality of second contact portions extending in the second direction.
Dependencies are inferred from the claim text.