Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby
AssigneeInfineon Technologies AG
InventorsAndre Hanke, Michael Dunkel
Life of this patent
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Abstract
The present invention relates to a method for producing a module including an integrated circuit die on a substrate. A substrate is provided, a metallization structure is provided which includes a conductive path and a metallization contact pad on the substrate. The integrated circuit die is placed onto the substrate, such that an integrated contact pad of the integrated circuit is positioned in close proximity to the metallization contact pad, and a conductive paste is selectively applied such that a conductive connection is formed between the integrated contact pad and the metallization contact pad.
Claims12
A method for producing a module including an integrated circuit die on a substrate, comprising:
- providing a substrate;
- providing a metallization layer including a conductive path and a metallization contact pad on the substrate;
- placing the integrated circuit die onto the substrate, such that an integrated contact pad of the integrated circuit die is positioned in close proximity to the metallization contact pad;
- and
- selectively applying a conductive paste which is adapted to form a conductive connection between the integrated contact pad and the metallization contact pad.
An integrated module, comprising:
- an integrated circuit die having a integrated contact pad to provide a contacting to the integrated circuit;
- a substrate on which the integrated circuit die is placed;
- a metallization layer provided on the substrate and including a conductive path and a metallization contact pad, wherein the integrated contact pad of the integrated circuit die is positioned in close proximity to the metallization contact pad;
- and
- a conductive paste structure which is applied to integrated contact pad and the metallization contact pad, such that a conductive connection is provided between the integrated contact pad and the metallization contact pad.
Dependencies are inferred from the claim text.