Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal

A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, comprising:

• (A) a compound that generates acid on irradiation with active light or radiation;
• and
• (B) a resin that displays increased alkali solubility under action of acid;
• wherein said component (B) comprises a resin formed from a copolymer containing a structural unit (b1), and a structural unit (b2) derived from a polymerizable compound containing an ether linkage, the structural unit (b1) represented by a general formula (1) shown below:
• (wherein, R1 represents a hydrogen atom or a methyl group, and R2 represents a lower alkyl group),
• and the polymerizable compound containing an ether linkage is a compound represented by a general formula (7) shown below, or phenoxypolyethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate, or tetrahydrofurfuryl (meth)acrylate:
• CH2═C(R′)COO—(CmH2m—CHR10—O)n—R″ (7)
• (wherein, R′ represents a hydrogen atom or a methyl group, R10 represents a hydrogen atom or an alkyl group of 1 or 2 carbon atoms, R″ represents an alkyl group or aryl group of 1 to 7 carbon atoms that may also contain an oxygen atom, m represents an integer of either 1 or 2, and n represents an integer from 1 to 10).