Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsToshiki Okui, Koichi Misumi
Life of this patent
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Abstract
A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, including (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) comprises a resin containing a structural unit (b1) with a specific structure, and another resin containing a structural unit (b2) with a specific structure.
Claims18
A chemically amplified positive photoresist composition for a thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, comprising:
- (A) a compound that generates acid upon irradiation with active light or radiation;
- and
- (B) a resin that displays increased alkali solubility under action of acid;
- wherein said component (B) comprises (b1) a resin containing a structural unit represented by a general formula (1) shown below, and (b2) a resin containing a structural unit represented by a general formula (2) shown below, wherein said resin (b2) comprises a structural unit derived from a polymerizable compound containing an ether linkage.
- (wherein, R1 represents a hydrogen atom or a methyl group, and R2 represents an acid-labile group)
- (wherein, R3 represents a hydrogen atom or a methyl group, R4 represents an alkyl group of 1 to 4 carbon atoms, and X represents a group which, in combination with a carbon atom bonded thereto, forms a hydrocarbon ring of 5 to 20 carbon atoms)
(canceled)
A chemically amplified positive photoresist composition for a thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, comprising:
- (A) a compound that generates acid upon irradiation with active light or radiation;
- (B) a resin that displays increased alkali solubility under action of acid;
- and
- an alkali-soluble resin (C);
- wherein said component (B) comprises (b1) a resin containing a structural unit represented by a general formula (1) shown below and (b2) a resin containing a structural unit represented by a general formula (2) shown below:
- (wherein, R1 represents a hydrogen atom or a methyl group, and R2 represents an acid-labile group)
- (wherein, R3 represents a hydrogen atom or a methyl group, R4 represents an alkyl group of 1 to 4 carbon atoms, and X represents a group which, in combination with a carbon atom bonded thereto, forms a hydrocarbon ring of 5 to 20 carbon atoms).
A thick-film photoresist laminated product, comprising:
- a support;
- and
- a thick-film photoresist layer with a film thickness of 10 to 150 μm, formed from a chemically amplified photoresist composition for a thick film, laminated on top of said support;
- wherein the chemically amplified photoresist composition for the thick film that is used for forming the thick-film photoresist layer with the film thickness of 10 to 150 μm on top of the support, comprises (A) a compound that generates acid on irradiation with active light or radiation and (B) a resin that displays increased alkali solubility under action of acid, and said component (B) comprises (b1) a resin containing a structural unit represented by a general formula (1) shown below and (b2) a resin containing a structural unit represented by a general formula (2) shown below:
- (wherein, R1 represents a hydrogen atom or a methyl group, and R2 represents an acid-labile group)
- (wherein, R3 represents a hydrogen atom or a methyl group, R4 represents an alkyl group of 1 to 4 carbon atoms, and X represents a group which, in combination with a carbon atom bonded thereto, forms a hydrocarbon ring of 5 to 20 carbon atoms).
Dependencies are inferred from the claim text.