Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsToshiki Okui, Koichi Misumi
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Abstract
A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, comprising (A) a compound that generates acid on irradiation with active light or radiation, (B) a resin that displays increased alkali solubility under the action of acid, and (C) an alkali-soluble resin, wherein the component (B) comprises a resin formed from a copolymer containing a structural unit (b1) with a specific structure.
Claims11
A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, comprising:
- (A) a compound that generates acid on irradiation with active light or radiation;
- (B) a resin that displays increased alkali solubility under action of acid;
- and
- (C) an alkali-soluble resin;
- wherein
- said component (B) comprises a resin formed from a copolymer containing a structural unit (b1) represented by a general formula (1) shown below:
- (wherein, R1 represents a hydrogen atom or a methyl group, R2 represents a lower alkyl group, and X represents a group which, in combination with a carbon atom bonded thereto, forms a hydrocarbon ring of 5 to 20 carbon atoms).
Dependencies are inferred from the claim text.