Optical transceiver

An optical transceiver, comprising:

• an optical subassembly that comprises:
• (i) a built-in chip portion that comprises a chip for light transmission and reception;
• and
• (ii) a receptacle portion that extends from a first end of the built-in chip portion and defines an optical path;
• wherein the built-in chip portion and the receptacle portion are attached to each other;
• a board electrically connected to a second end of the built-in chip portion that is opposite to the first end of the built-in chip portion;
• a housing that houses the optical subassembly and the board;
• and
• a holding member that comprises a front rib comprising a groove into which the receptacle portion is fitted, a back rib to which the board is secured, and a side rib that links the front rib and the back rib;
• wherein the holding member holds the optical subassembly;
• wherein the housing further comprises a heat radiation sheet disposed on a predetermined inside face of the housing;
• wherein the optical subassembly comprises a predetermined face that is at the same level as an outside face of the holding member or protrudes from the outside face of the holding member;
• wherein the predetermined face of the optical subassembly is in contact with the heat radiation sheet;
• wherein the optical subassembly is connected through a lead to the board, and
• wherein the lead has a shift quantity of ±0.1 mm or less in a direction of a thickness of the heat radiation sheet between a reference position of the lead expected when the optical subassembly is at a reference position and a position of the lead in a mounted state where the optical subassembly, the board and the holding member are mounted on the housing;
• and
• wherein the reference position of the optical subassembly is defined as a position where the optical subassembly is targeted to sit after being mounted and after being shifted by a predetermined distance in a direction that the heat radiation sheet is compressed from its original thickness.

An optical transceiver, comprising:

• an optical subassembly that comprises a built-in chip portion and a receptacle portion;
• a board electrically connected to one end of the built-in chip portion;
• a housing that houses the optical subassembly and the board, wherein the housing comprises a bottom plate;
• and
• a holding member to hold the optical subassembly, wherein the holding member is disposed separately on the bottom plate of the housing;
• and
• wherein the optical subassembly and the board are securely fixed to the holding member.

A method for assembling an optical transceiver, comprising the steps of:

• integrating a built-in chip portion that comprises a chip for light transmission and reception and a receptacle portion that defines an optical path into an optical subassembly;
• securely fixing the optical subassembly to a holding member, wherein the holding member comprises a front rib, a back rib, and a side rib that links the front rib and the back rib;
• securely fixing a board to the back rib of the holding member;
• and
• attaching the optical subassembly, holding member, and board inside a housing, wherein said housing comprises a top plate, a side plate, and a bottom plate.