Heat spreader
AssigneeIntel Corporation
InventorsPaul Gauche, Robert Jackson
Life of this patent
Estimating the term…
Abstract
According to some embodiments, an arrangement is provided for cooling a heat-generating device, including a memory module (e.g., a small outline dual inline memory module), in a system such as a laptop computer. The arrangement includes a heat spreader having a first section including at least one thermally conductive coupling member to thermally engage surfaces of electronic components on the heat-generating device and a second section including at least one spring member to cause pressurized engagement between the first section and the surfaces of the electronic components. The heat spreader may further be thermally coupled to a heat exchanger or a keyboard from which the heat is dissipated. Other embodiments are also described and claimed.
Claims22
A heat spreader to dissipate heat generated by electronic components on a side of a heat-generating device, comprising:
- a first section having at least one thermally conductive coupling member, said at least one coupling member configured to engage a surface of at least one of the electronic components on the side of said heat-generating device;
- and
- a second section having at least one spring member, said at least one spring member capable of deforming, when pressure is exerted on the top of the second section, and recovering, when the pressure is released;
- said first section located on the top of and coupled to said second section.
A system, comprising:
- a heat-generating device releasably locked into a pivot connector, said pivot connector both electronically and mechanically coupled to a motherboard of a computer system, said heat-generating device having electronic components on a side facing said motherboard and a surface of at least one of said electronic components being substantially parallel to said motherboard when said heat-generating device is locked into said pivot connector;
- and
- a heat spreader located on said motherboard to help dissipate heat generated by at least one of said electronic components on the motherboard side of said heat-generating device, said heat spreader engaging a surface of at least one of said electronic components when said heat-generating device is locked into said pivot connector.
Dependencies are inferred from the claim text.