Cooler for electronic equipment
AssigneeNEC Corporation
InventorsKazuyuki Mikubo, Sakae Kitajo, Atsushi Ochi, Mitsuru Yamamoto
Life of this patent
Estimating the term…
Abstract
A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.
Claims19
A cooling device for an electronic equipment, comprising:
- a cooling panel including a bottom heat radiation plate and a top heat radiation plate, at least one of which is provided with a groove, said bottom heat radiation plate and top heat radiation plate being bonded together to form a passage of refrigerant;
- and
- a circulation pump fixed onto said cooling panel to circulate said refrigerant through said passage for radiating heat transferred to said cooling panel, wherein:
- said top heat radiation plate is provide with an inlet port through which said refrigerant flows from said passage to said circulation pump and an outlet port through which said refrigerant flows from said circulation pump to said passage;
- and
- said circulation pump is fixed onto said inlet port and outlet port.
A cooling device for an electronic equipment, comprising a substrate, a passage embedded in said substrate and passing therethrough refrigerant, a circulation pump disposed on a surface of said substrate, and a reservoir communicated with said first passage via a branch hole, wherein said circulation pump circulates said refrigerant through said passage to radiate heat transferred to said substrate.
An electronic equipment having mounting thereon a cooling device for an electronic equipment, the cooling device comprising:
- a cooling panel including a bottom heat radiation plate and a top heat radiation plate, at least one of which is provided with a groove said bottom heat radiation plate and top heat radiation plate being bonded together to form a passage of refrigerant;
- and
- a circulation pump fixed onto said cooling panel to circulate said refrigerant through said passage for radiating heat transferred to said cooling panel, wherein:
- said top heat radiation plate is provide with an inlet port through which said refrigerant flows from said passage to said circulation pump and an outlet port through which said refrigerant flows from said circulation pump to said passage;
- and
- said circulation pump is fixed onto said inlet port and outlet port.
Dependencies are inferred from the claim text.