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US 2006/0139880 A1Published application
Integrated circuit cooling system including heat pipes and external heat sink
AssigneeIntel Corporation
InventorAlan Tate
Life of this patent
Estimating the term…
Abstract
An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the heat pipes are thermally coupled to the IC package, and the second ends of the heat pipes are thermally coupled to the base of the heat sink to transfer heat from the IC package to the heat sink
Claims19
An apparatus comprising:
- an integrated circuit (IC) package;
- a heat sink having a base and a plurality of fins extending from the base;
- and
- a plurality of heat pipes, each heat pipe having a first end and a second end, the first ends of the heat pipes thermally coupled to the IC package, the second ends of the heat pipes thermally coupled to the base of the heat sink to transfer heat from the IC package to the heat sink.
1 more element
An apparatus comprising:
- a housing;
- an IC package located within the housing:
- a heat sink mounted as part of the housing and having fins that extend exteriorly from the housing, the heat sink also having a surface that is at an interior of the housing;
- and
- a plurality of heat pipes, each having a first end thermally coupled to the IC package and a second end coupled to said surface of said heat sink.
2 more elements
A method comprising:
- providing a plurality of heat pipes to transport heat from an IC package mounted inside a computer housing to a heat sink mounted as part of the computer housing;
- providing a plurality of fins mounted along the heat pipes;
- receiving an output from a temperature sensor;
- and
- selectively blowing air between said fins in response to the received output.
2 more elements
Dependencies are inferred from the claim text.