System for controlling semiconductor packaging particulate contamination
OwnerPhillip Weberinventor
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Abstract
The present invention provides a system for controlling semiconductor packaging particulate contamination. According to the present invention, a semiconductor packaging component (102) is provided, having a first surface (104) along which a plurality of connection features (110, 112) are disposed or located, and an area (202) to which a semiconductor die is to be connected. One or more areas along the first surface are covered with an encapsulant (200) to isolate the area(s) from deleterious stresses and to impede the egress of any particulate matter therefrom.
Claims20
A method of preparing a semiconductor packaging component for assembly, the method comprising the steps of:
- providing a first semiconductor packaging component, having a first surface to which a semiconductor die is to be connected;
- and
- selectively applying an encapsulant to one or more areas along the first surface.
A semiconductor device comprising:
- a substrate, having a plurality of bond pads disposed along a first surface thereof;
- a semiconductor die, attached to the substrate and operatively coupled to the plurality of bond pads;
- a package lid, attached to the substrate, forming an enclosure within which the die and bond pads are sealed;
- and
- an encapsulant, disposed along the first surface of the substrate within the enclosure, exclusive of the plurality of bond pads.
A system for controlling semiconductor packaging particulate contamination, the system comprising:
- a semiconductor packaging component, having a first surface to which a semiconductor die is to be connected;
- cleaning the first surface;
- and
- selective covering of one or more areas along the first surface with an encapsulant prior to connection of the semiconductor die.
Dependencies are inferred from the claim text.