Thermal interface structure with integrated liquid cooling and methods
AssigneeIntel Corporation
InventorsSabina Houle, James Matayabas
Life of this patent
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Abstract
A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.
Claims24
A processor assembly, comprising:
- a processor chip;
- a heat spreader;
- a thermal interface structure, including;
- a metal perimeter seal portion to contain an amount of liquid, the seal portion coupled between the heat spreader and at least a portion of a surface of the integrated circuit chip;
- an amount of liquid material located within the perimeter seal portion;
- and
- a pump operably coupled to the perimeter seal portion capable of circulating the amount of liquid material through the perimeter seal portion.
An information handling system, comprising:
- a dynamic random access memory;
- a system bus coupled to the dynamic random access memory;
- a processor assembly coupled the system bus, the processor assembly including:
- a processor chip;
- a heat spreader;
- a thermal interface structure, including;
- a metal perimeter seal portion to contain an amount of liquid, the seal portion coupled between the heat spreader and at least a portion of a surface of the integrated circuit chip;
- an amount of liquid material located within the perimeter seal portion;
- and
- a pump operably coupled to the perimeter seal portion capable of circulating the amount of liquid material through the perimeter seal portion.
A processor assembly, comprising:
- a processor chip;
- a heat spreader;
- a thermal interface structure, including;
- a metal perimeter seal portion to contain an amount of liquid, the seal portion coupled between the heat spreader and at least a portion of a surface of the integrated circuit chip, wherein the at least one interface with the metal perimeter seal portion includes cold formed features;
- an amount of liquid material located within the perimeter seal portion;
- a pump operably coupled to the perimeter seal portion to circulate the amount of liquid material through the perimeter seal portion;
- and
- a heat exchanger located apart from the thermal interface structure to remove heat from the amount of liquid material before returning to the thermal interface structure.
An information handling system, comprising:
- a dynamic random access memory;
- a system bus coupled to the dynamic random access memory;
- a processor assembly coupled the system bus, the processor assembly including:
- a processor chip;
- a heat spreader;
- a thermal interface structure, including;
- a metal perimeter seal portion to contain an amount of liquid, the seal portion coupled between the heat spreader and at least a portion of a surface of the integrated circuit chip, wherein the at least one interface with the metal perimeter seal portion includes cold formed features;
- an amount of liquid material located within the perimeter seal portion;
- a pump operably coupled to the perimeter seal portion to circulate the amount of liquid material through the perimeter seal portion;
- and
- a heat exchanger located apart from the thermal interface structure to remove heat from the amount of liquid material before returning to the thermal interface structure.
Dependencies are inferred from the claim text.