Package for semiconductor components and method for producing the same

Abstract

The invention relates to a packaging for semiconductor components such as FBGA packages in BOC technology or the like, wherein at least the back and the lateral edges of a chip (2) mounted on a substrate are enclosed by a mold coating (6), the casting compound used for the mold coating (6) being linked with the substrate and forming an integrated whole therewith. The invention further relates to a method for producing such a packaging for semiconductor components. The aim of the invention is to provide a packaging for semiconductor components which is characterized by reduced thermomechanical stress and at the same time a substantially improved adhesion of the mold coating to the substrate, thereby allowing for a higher package load. According to the invention, this aim is achieved in that the substrate (1), at least in some areas, has a spongy structure (7) that is provided with pore-type openings and that extends from the surface to the depths of the structure so that the molding material penetrates the substrate (1) by capillary attraction.

Dependencies are inferred from the claim text.