Method and structure for implanting bonded substrates for electrical conductivity

A process for forming multi-layered substrates, the process comprising:

• providing a first substrate, the first substrate comprising a thickness of material to be removed, the thickness of material to be removed comprising a first face region;
• joining the first face region of the first substrate to a second face region of a second substrate to form an interface region between the first face region of the first substrate and the second face region of the second substrate;
• removing the thickness of material from the first substrate while maintaining attachment of the first face region of the first substrate to the second face region of the second substrate;
• forming a masking layer overlying a surface region of the thickness of material to form an exposed region of a portion of the thickness of material;
• implanting particles into the exposed region and through a portion of the interface region to form a region of the particles within the vicinity of the portion the interface region to couple the portion of the thickness of material to the second substrate to cause formation of an implanted region including at least the exposed region and the portion of the thickness of material;
• and
• subjecting at least the implanted region to at least a thermal treatment process to cause crystallization of the implanted region.