Semiconductor device having raised cell landing pad and method of fabricating the same

A method of fabricating a semiconductor device comprising:

• forming an isolation layer defining an active region in an area of a semiconductor substrate;
• forming a gate electrode traversing the active region;
• injecting impurity ions into the active region to form a source region at one side of the gate electrode and form a drain region at a second side of the gate electrode;
• forming a first interlayer insulating layer which covers the semiconductor substrate having the gate electrode;
• forming a source landing pad which passes through the first interlayer insulating layer and is electrically connected to the source region;
• forming a drain landing pad which passes through the first interlayer insulating layer and is electrically connected to the drain region;
• forming a pad extending conductive layer which contacts with the source landing pad and the drain landing pad and covers the first interlayer insulating layer;
• and
• patterning the pad extending conductive layer to form a pad extending part on at least one of the source landing pad and the drain landing pad, wherein the pad extending part has an upper surface which is located above upper surfaces of the source landing pad and the drain landing pad.

A method of fabricating a semiconductor device comprising:

• forming an isolation layer defining an active region in an area of a semiconductor substrate;
• forming a gate electrode on the active region;
• forming a source region on one side of the gate electrode;
• forming a drain region on another side of the gate electrode;
• forming a first interlayer insulating layer covering the semiconductor substrate having the gate electrode;
• forming a source landing pad arranged on the source region;
• forming a drain landing pad arranged on the drain region;
• forming a pad extending part on at least one of the source landing pad and the drain landing pad;
• forming a bit line electrically connected to the drain landing pad;
• and
• forming a storage node contact plug electrically connected to the source landing pad.