Processing a memory link with a set of at least two laser pulses

A laser system for severing a conductive link in an integrated circuit (IC), comprising:

• a laser source operable to generate a beam comprising at least two laser pulses, the laser pulses including a first laser pulse and a second laser pulse;
• a device operable to change an energy characteristic of at least one of the laser pulses wherein the device is located between the laser source and the integrated circuit;
• and
• a beam positioning system operable to utilize position data representative of locations of one or more conductive links and to coordinate directing the laser pulses to a selected conductive link, wherein the laser pulses traverse through a focusing lens, the selected conductive link and the focusing lens are in relative movement while the laser pulses are directed to the selected conductive link, the first and second laser pulses are sequentially directed to the selected conductive link, and the laser pulses sever the selected conductive link.