Heat dissipation device
AssigneeFoxconn Technology Co., Ltd.
InventorsDong Wang, Tsung-Lung Lee, Li He
Life of this patent
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Abstract
A heat dissipation device for electronic devices on a substrate comprises a base contacting one of the electronic devices for absorbing heat therefrom. A plurality of fins arranged on the base for dissipating heat. A plurality of airflow channels is defined between the fins, and each channel defines an intake and an outlet. A fan is located adjacent to the intakes and provides airflow entering the channels through the intakes and leaving the channels through the outlets. A first guiding member is located adjacent to the outlets. The airflow out of the outlets is guided, by the first guiding member, to be deflected towards the substrate for cooling other electronic devices neighboring the one contacting with the base.
Claims20
A heat dissipation device comprising:
- a base;
- a plurality of fins arranged on the base, a plurality of airflow channels formed between the fins, each channel defining a front intake and a rear outlet;
- and
- a first guiding member located adjacent to the outlets of the channels and extending in a direction inclinedly donwardly away from the intakes of the channels, and inclined relative to the base, the guiding member is used for guiding a part of an airflow to flow inclinedly downwards and rearwards after the part of the airflow enters the channels via the intakes and leaves the channels via the outlets.
A heat dissipation device for electronic devices on a substrate comprising:
- a base for contacting one of the electronic devices for absorbing heat;
- a plurality of fins arranged on the base, a plurality of airflow channels formed between the fins, and each channel defining an intake and an outlet;
- a fan located adjacent to the fins and providing an airflow entering the channels through the intakes;
- a first guiding member located adjacent to the outlets;
- wherein the airflow leaving the channels through the outlets is guided, by the first guiding member, towards the substrate for cooling the other electronic devices.
Dependencies are inferred from the claim text.