Back to results
US 2006/0137715 A1Published application
Cleaning method for removing copper-based foreign particles
AssigneeDongbuAnam Semiconductor Inc.
InventorByoung-Yoon Seo
Life of this patent
Estimating the term…
Abstract
A cleaning method for removing copper-based foreign particles from a wafer. The method includes changing the zeta-potential of the copper-based foreign particles to negative and removing the copper-based foreign particles having negative zeta-potential by spin-scrubbing. Consequently, the quality of the semiconductor device and the yield thereof can be increased.
Claims8
A cleaning method for removing copper-based foreign particles, comprising:
- changing zeta-potential of the copper-based foreign particles to negative;
- and
- removing the copper-based foreign particles having the negative zeta-potential by spin-scrubbing.
Dependencies are inferred from the claim text.