Plasma apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsHee-Hwan Choe, Sang-Gab Kim, Min-Seok Oh, Hong-Kee Chin
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Abstract
The present invention relates to a plasma apparatus comprising a reaction chamber having a reaction space which accommodates a substrate to be treated; a coil located on the outside of the reaction space; a power source applying alternating frequency power on the coil; and a conducting plate located between the coil and the reaction space and generating an induced current from the alternating frequency power applied on the coil. Thus, the present invention provides a plasma apparatus that induces a uniform electric field in an internal gas of the reaction chamber.
Claims20
A plasma apparatus comprising:
- a reaction chamber having a reaction space to accommodate a substrate to be treated;
- a coil located on the outside of the reaction space;
- a power source applying alternating frequency power on the coil;
- and
- a conducting plate located between the coil and the reaction space and generating an induced current from the alternating frequency power applied on the coil.
A plasma apparatus comprising:
- a reaction chamber having a reaction space to accommodate a substrate to be treated;
- a coil located on the outside and in the upper part of the reaction space over the area thereof;
- a power source applying alternating frequency power on the coil;
- and
- a conducting plate located between the coil and the reaction space and which generates an induced current from the alternating frequency power applied on the coil;
- a gas inlet to allow an inlet gas to flow into the reaction space;
- and
- a gas outlet to allow an outlet gas to flow out of the reaction space.
Dependencies are inferred from the claim text.