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US 2006/0134982 A1Published application
Methods and devices for connecting and grounding an EMI shield to a printed circuit board
AssigneeWavezero, Inc.
InventorsJohn Zarganis, Rocky Arnold
Life of this patent
Estimating the term…
Abstract
The present invention provides electronic devices, kits, and connector assemblies for coupling an EMI shield to a ground trace. In one embodiment, the present invention provides an electronic device comprising a printed circuit board and an EMI shield that has a flange around at least a portion of a perimeter of the EMI shield. One or more connectors coupled to the flange removably contact the flange to a ground trace of the printed circuit board.
Claims54
An electronic device comprising:
- a printed circuit board;
- an EMI shield comprising a flange around at least a portion of a perimeter of the EMI shield;
- and
- one or more connectors coupled to the flange so as to removably couple and ground the flange of the EMI shield to the printed circuit board.
1 more element
A kit comprising:
- an EMI shield comprising a flange around at least a portion of a perimeter of the EMI shield;
- and
- one or more connectors coupleable to the flange so as to removably couple and ground the flange of the EMI shield to the printed circuit board.
An electronic device comprising:
- a printed circuit board comprising an electronic component and a grounding portion;
- an EMI shield comprising an upper surface that includes one or more features, a plurality of sidewalls that extend from the top surface, and a flange that extends in a direction substantially parallel to a surface of the printed circuit board;
- and
- a housing of the electronic device configured to enclose the printed circuit board and EMI shield,
- wherein the features on the top surface interact with an inner surface of the housing so as to compress the flange of the EMI shield against the grounding portion on the printed circuit board.
2 more elements
An EMI shield comprising:
- a body comprising an upper surface that includes one or more features, a plurality of sidewalls that extend from the top surface, and a flange that extends laterally away from the sidewalls;
- and
- wherein the features on the top surface are shaped to interact with an inner surface of a housing of an electronic device when the housing is around the printed circuit board so as to compress the flange of the metallized polymer against a grounding portion on the printed circuit board.
An electronic device comprising:
- a printed circuit board comprising an electronic component and a ground trace;
- an EMI shield comprising a top surface and a plurality of side walls;
- and
- a conductive connector assembly fixedly attached to the ground trace, the conductive connector releasably coupling the EMI shield to the ground trace.
1 more element
A kit comprising:
- an EMI shield comprising a top surface and a plurality of side walls;
- and
- a conductive connector assembly connectable to a ground trace of a printed circuit board, the conductive connector assembly configured to releasably couple the EMI shield to the ground trace.
Dependencies are inferred from the claim text.