Method of machining substrate and method of manufacturing element
AssigneeSeiko Epson Corporation
InventorsYutaka Yamazaki, Kazushige Umetsu
Life of this patent
Estimating the term…
Abstract
A method of machining a substrate etches a substrate according to a predetermined length and depth from an intersection between a first predetermined dividing line and a second predetermined dividing line, which cross each other in a T-shaped line, along the second predetermined dividing line of the predetermined dividing lines being used to cut the substrate, and divides the substrate along the predetermined dividing lines which are not etched by laser machining.
Claims19
A method of machining a substrate comprising:
- etching a substrate according to a predetermined length and depth from an intersection between a first predetermined dividing line and a second predetermined dividing line, which cross each other in a T-shaped line, along the second predetermined dividing line of the predetermined dividing lines being used to cut the substrate;
- and
- dividing the substrate along the predetermined dividing lines which are not etched by laser machining.
A method of machining a substrate comprising:
- etching a substrate according to a predetermined depth on a second predetermined dividing line, which crosses a first predetermined dividing line to form a T-shaped line, and on a predetermined dividing line, which is parallel to the second predetermined dividing line of the predetermined dividing lines being used to cut the substrate;
- and
- dividing the substrate along the predetermined dividing lines which are not etched by the laser machining.
A method of machining a substrate comprising dividing the substrate while leaving uncut a predetermined length from an intersection between a first predetermined dividing line and a second predetermined dividing line, which cross each other in a T-shaped line, along the second predetermined dividing line of the predetermined dividing lines being used to cut the substrate.
A method of machining a substrate comprising:
- etching a predetermined length of a plurality of predetermined dividing lines from a predetermined point along the plurality of predetermined dividing lines, which are extended from the predetermined point and are not arranged in the same straight line of the predetermined dividing lines being used to cut the substrate;
- and
- dividing the substrate along the predetermined dividing lines which are not etched by the laser machining.
Dependencies are inferred from the claim text.