Semiconductor memory device and method for fabricating the same
AssigneeHynix Semiconductor Inc.
InventorsSeo-Min Kim, Cheol-Kyu Bok
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AssigneeHynix Semiconductor Inc.
InventorsSeo-Min Kim, Cheol-Kyu Bok
Estimating the term…
The present invention relates to a semiconductor memory device and a method for fabricating the same. Particularly, the semiconductor memory device includes at least more than two capacitors to decrease the thickness of an insulation layer and increase the size of each capacitor, wherein the thickness of the insulation layer and the size of the capacitor are factors for increasing parasitic capacitance and leakage currents. Also, the two capacitors are arranged diagonally, thereby widening the width of each capacitor formed. Furthermore, in case of forming the double capacitors according to the preferred embodiment of the present invention, an additional reticle is not required to form the contact holes for each capacitor due to their inverted disposition relationship.
A semiconductor memory device, comprising:
Dependencies are inferred from the claim text.