Multi-transmission phase mask and exposure method using the same

Abstract

A multi-transmission phase mask, and an exposure method using the same are disclosed. The mask comprises a transparent substrate, a light shielding film formed on the transparent substrate and defining a light transmission region and a light shielding region, and a phase inversion region formed on a predetermined portion of the light transmission region so as to allow exposure light to be transmitted therethrough with a phase of the light being inverted. In the method, a pattern of a semiconductor diode is exposed on a wafer by illuminating exposure light to the multi-transmission phase mask through a modified illumination system comprising at least two poles, each having a preset opening angle. According to the present invention, a defect wherein a pattern unit of a storage node contact pattern is not regularly opened on a wafer, or a defect wherein the pattern units are bridged to each other can be prevented from occurring.

Dependencies are inferred from the claim text.