Optical-routing boards for opto-electrical systems and methods and apparatuses for manufacturing the same
AssigneeFujitsu Limited
InventorKuo-Chuan Liu
Life of this patent
Estimating the term…
Abstract
Disclosed are optical-routing boards for opto-electrical systems having optical waveguides embedded in non-laminated optical substrates that enable optical signals to be routed among opto-electric components mounted on the top surfaces of the optical substrates. Methods for making the optical-routing boards are also disclosed. The waveguides are formed by focused pulse-laser writing, with the focal point of the pulsed-laser beam being moved in a three-dimensional manner through the non-laminated substrate. Bevel surfaces are preferably formed in the substrate to facilitate bending of the waveguides.
Claims30
An optical-routing board comprising:
- a non-laminated substrate having a top surface, a bottom surface, and one or more sides;
- a first beveled surface formed at a side of the substrate;
- a second beveled surface formed at a side of the substrate;
- a waveguide core formed within said non-laminated substrate having a first segment extending from the substrate's top surface to a first point on the first beveled surface, a second segment extending from the first point to a second point on the second beveled surface, and a third segment extending from the second point to the substrate's top surface.
An optical-routing board comprising:
- a non-laminated substrate having a top surface, a bottom surface, and at least one side;
- a first void formed in the bottom surface of the non-laminated substrate, the first void having as least one sidewall;
- a waveguide core formed within said non-laminated substrate having a first segment extending from the substrate's top surface to a first point on the at least one sidewall of the first void, a second segment extending from the first point to a second point on the at least one side of the substrate.
An optical-routing board comprising:
- a non-laminated substrate having a top surface, a bottom surface, and at least one side;
- a first void formed at the bottom surface of the non-laminated substrate, the first void having as least one sidewall;
- a second void formed at the bottom surface of the non-laminated substrate, the second void having as least one sidewall;
- a waveguide core formed within said non-laminated substrate having a first segment extending from the substrate's top surface to a first point on the at least one sidewall of the first void, a second segment extending from the first point to a second point on the at least one sidewall of the second void, and a third segment extending from the second point to the substrate's top surface.
A method of forming an optical wiring board, the method comprising:
- (a) forming a first beveled surface on a non-laminated substrate, the substrate having a top surface, a bottom surface, and at least one side, the beveled surface being formed on the at least one side or a sidewall of a void located at the bottom surface of the non-laminated substrate;
- (b) forming a first waveguide-core segment in the substrate using a laser emitting pulsed light having pulse durations of less than 100 femto-seconds per pulse such that the first waveguide-core segment has a first end disposed substantially at the first beveled surface at a first point and a second end disposed away from the first point;
- and
- (c) forming a second waveguide-core segment in the substrate using a laser emitting pulsed light having pulse durations of less than 100 femto-seconds per pulse such that the second waveguide-core segment has a first end disposed substantially at the first point and a second end disposed away from the first point.
Dependencies are inferred from the claim text.