Heat dissipation assembly and method for cooling heat-generating components in an electrical device
AssigneeIndustrial Origami, Inc.
InventorMax Durney
Life of this patent
Estimating the term…
Abstract
A heat dissipation structure suitable for use in electrical and electronic equipment enclosed in housings which equipment is fan cooled. The structure includes a partition array inside the housing formed to preferentially cool relatively high heat-generating electronic components mounted to a PCB board or the like. The structure advantageously includes partitions which narrow to a throat that accelerates the airflow past the heat-generating components for maximum heat transfer. A method of dissipating heat from the high heat-generating electronic components in an electronic device also is disclosed.
Claims17
A method of cooling electronic components having high heat-generating electronic components, the method comprising the steps of:
- locating high heat-generating electronic components on a component supporting substrate;
- directing airflow in the apparatus housing produced by a fan preferentially over the located high-heat generating components for increased heat transfer to the flowing air;
- and
- exhausting the directed air from the apparatus housing.
A heat dissipation structure for cooling heat-generating components in an electrical or electronic device having a housing and a cooling fan, the structure comprising:
- a partition array positioned in the equipment housing dimensioned and configured to preferentially direct the airflow in the housing produced by the fan across relatively high heat-generating electronic components.
Dependencies are inferred from the claim text.