Electrostatic chuck with built-in heater

Abstract

The present invention provides an electrostatic chuck with a built-in heater, with which the apparatus can start operation rapidly at the wafer chucking surface, and a uniform temperature distribution can be rapidly established over the wafer. Gas-escape grooves which communicate with the outer periphery are provided to one or both sides of the electrostatic chuck. The chucking function of the electrostatic chuck with a built-in heater of the present invention is exhibited by stacking an insulating underlayer, an electroconductive layer, and an insulating topmost layer by the CVD method on a heat-conductive base body. It is preferable that the gas-escape groove has a cross section smoothly dropping off from the flat surface area of the insulating topmost layer to the bottom of the groove, and that the gas-escape groove has a width of 1 to 3 mm and a depth of 0.03 to 0.2 mm with a spacing between grooves of 5 to 15 mm.

Dependencies are inferred from the claim text.