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US 2006/0131755 A1Published application
Method of making circuitized substrate
AssigneeEndicott Interconnect Technologies, Inc.
InventorsRobert Japp, Voya Markovich, Cheryl Palomaki, Kostas Papathomas, David Thomas
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Abstract
A method of making a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.
Claims16
A method of making a circuitized substrate, said method comprising:
- providing a first dielectric layer including an epoxy resin material and a filler comprised of particles having a size within the range of from about 200 Angstroms to about 35 microns, said particles comprising from about 10 percent to about 80 percent by volume of said first dielectric layer, said first dielectric layer not including continuous fibers, semi-continuous fibers or the like as part thereof, said first dielectric layer having a dielectric constant within the range of from about 3.5 to about 4.0;
- forming a plurality of conductive thru-holes within said first dielectric layer having a pattern density of from about 5,000 to about 10,000 holes per square inch of said first dielectric layer;
- and
- positioning at least one circuitized layer on said first dielectric layer.
1 more element
Dependencies are inferred from the claim text.