Semiconductor device and method of arranging pad thereof

A semiconductor device comprising:

• a substrate;
• at least one first active region disposed in a first region of the substrate;
• at least one second active region disposed in a second region adjacent to the first region of the substrate;
• a plurality of first contacts disposed on the second active region;
• a first insulating layer disposed on the first active region and between the first contacts;
• a poly layer disposed on the first contacts and the first insulating layer;
• a plurality of second contacts disposed on the poly layer in the second region;
• a second insulating layer disposed between the second contacts and on the poly layer in the first region;
• and
• a pad disposed on the second insulating layer and the second contacts.

A method of forming a pad of a semiconductor device, comprising:

• forming at least one active region in a substrate;
• forming a plurality of separate first contacts on the active region;
• forming a poly layer on the first contacts;
• forming a plurality of separate second contacts on the poly layer;
• and
• forming the pad on the second contacts.

A method of forming a pad of a semiconductor device, comprising:

• forming at least one first active region in a first region of a substrate;
• forming at least one second active region in a second region adjacent to the first region of the substrate;
• forming a plurality of first contacts on the second active region and forming a first insulating layer on the first active region between the first contacts;
• forming a poly layer on the first contacts and the first insulating layer;
• forming a plurality of second contacts on the poly layer in the second region and forming a second insulating layer between the second contacts and on the poly layer in the first region;
• and
• forming the pad on the second insulating layer and the second contacts.