Method and apparatus for chip cooling using a liquid metal thermal interface

A thermal interface for facilitating thermal contact between an integrated circuit chip surface and a heat sink surface, the thermal interface comprising:

• a liquid metal layer comprising a liquid metal material;
• a first supplemental layer in contact with a first surface of said liquid metal layer, said first supplemental layer for adhering said liquid metal layer to said integrated circuit chip surface while isolating said liquid metal material from said integrated chip surface;
• and
• a second supplemental layer in contact with a second surface of said liquid metal layer, said second supplemental layer for adhering said liquid metal layer to said heat sink surface while isolating said liquid metal material from said heat sink surface.

A method for thermally interfacing an integrated circuit chip surface to an opposing heat sink surface comprising:

• applying a first barrier layer to said integrated circuit chip surface, said first barrier layer for bonding said integrated circuit chip surface to a liquid metal;
• applying a second barrier layer to said heat sink surface, said second barrier layer for bonding said heat sink surface to a liquid metal;
• and
• providing a liquid metal layer between said first and second barrier layers, said liquid metal layer comprising a liquid metal material.