Semiconductor apparatus and circuit apparatus

A semiconductor apparatus comprising:

• a first substrate;
• a semiconductor chip fixedly secured on one side of the first substrate;
• a coil formed in a spiral shape on the other side of the first substrate;
• a first through-hole extending between one side and the other side of the first substrate and electrically connecting an electrode of the semiconductor chip and an electrode of the coil;
• a conductive pattern formed on a surface of the one side of the first substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil;
• a second through-hole extending between the one side and the other side of the first substrate and electrically connecting another electrode of the semiconductor chip and an electrode formed on the other side of the first substrate;
• and
• an insulating resin covering the one side of the first substrate.

A semiconductor apparatus comprising:

• a substrate;
• a semiconductor chip fixedly secured on one side of the substrate;
• a spirally shaped coil formed on a surface of the one side of the substrate facing to the semiconductor chip and electrically connected to the semiconductor chip;
• and
• a conductive pattern formed on a surface of the other side of the substrate opposite to the coil for stabilizing an inductance characteristic of the coil.

A semiconductor apparatus comprising:

• a first substrate;
• a semiconductor chip fixedly secured to one side of the first substrate;
• a spirally shaped coil formed on a surface of the one side of the first substrate facing to the semiconductor chip and electrically connected to the semiconductor chip;
• a conductive pattern formed on a surface of the other side of the first substrate opposite to the coil for stabilizing an inductance characteristic of the coil;
• an electrode formed on a surface of the other side of the first substrate;
• a through-hole extending between the one side and the other side of the first substrate and electrically connecting an electrode of the semiconductor chip and an electrode formed on a surface of the other side of the first substrate;
• and
• an insulating resin covering the one side of the first substrate.