Coating for enhancing adhesion of molding compound to semiconductor devices
AssigneeASM Assembly Automation Ltd.
InventorsJianxiong Li, Chi Chaw, Ngai Tsui, Deming Liu, Yiu Kwan, Wai Chan
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Abstract
A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.
Claims21
Method of enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier prior to molding the semiconductor device, comprising the step of coating the semiconductor device with a polymer primer.
Dependencies are inferred from the claim text.