Semiconductor device
AssigneePanasonic Corporation
InventorKeisuke Kishishita
Life of this patent
Estimating the term…
Abstract
A mesh source wiring composed of first source wirings, second source wirings, and contacts for mesh source wiring is connected, through contacts for strap source wiring, with strap source wirings formed on a wiring layer nearer a substrate than wiring layers where the mesh source wiring is formed. The cell source wirings formed on a wiring layer nearer the substrate than the wiring layer where the strap source wirings are formed are connected with the strap-source wirings through contacts for cell source wiring.
Claims12
A semiconductor device having a substrate and a plurality of wiring layers including first, second, third, and fourth wiring layers, comprising:
- a plurality of first source wirings formed in parallel with each other on the first wiring layer;
- a plurality of second source wirings formed in a direction intersecting at a right angle with the first source wirings on the second wiring layer, the second wiring layer being located nearer the substrate than the first wiring layer;
- a plurality of third source wirings formed on the third wiring layer, the third layer being located nearer the substrate than the second wiring layer;
- a plurality of fourth source wirings formed on the fourth wiring layer, the fourth wiring layer being located nearer the substrate than the third wiring layer;
- a first contact that connects one of the first source wirings and one of the second source wirings with each other at a part where the first source wiring and the second source wiring intersect with each other;
- a second contact that connects one of the third source wirings and at least one of the first source wirings and the second source wirings with each other;
- and
- a third contact that connect one of the third source wirings and one of the fourth source wirings with each other.
Dependencies are inferred from the claim text.