Organic electronic devices having two dimensional series interconnections

A device comprising:

• a substrate;
• a plurality of organic electronic devices, wherein each of the organic electronic devices comprises an anode and a cathode, and wherein each of the plurality of organic electronic devices is electrically coupled in series;
• an electro-active material having a first side and a second side disposed between the anode and cathode of each of the plurality of organic electronic devices;
• and
• an interconnect layer disposed on the substrate, wherein the interconnect layer is configured to electrically couple in series a first organic electronic device and a second organic electronic device disposed adjacent to each other via electrically coupling an anode of the first organic electronic device and a cathode of the second organic electronic device, wherein respective electrodes coupled in series are disposed on the first side of the electro-active material.

A device comprising:

• a substrate;
• a plurality of organic electronic devices, wherein each of the organic electronic devices comprises an anode, a cathode and a third electrode, wherein the third electrode is disposed between the anode and cathode, and wherein each of the plurality of organic electronic devices is electrically coupled in series;
• at least one electro-active material having a first side and a second side disposed between each of an area between the anode and the third electrode and the cathode and third electrode of each of the plurality of organic electronic devices;
• and
• an interconnect layer disposed on the substrate, wherein the interconnect layer is configured to electrically couple in series a first organic electronic device and a second organic electronic device disposed adjacent to each other via electrically coupling an anode of the first organic electronic device and a cathode of the second organic electronic device, wherein respective electrodes coupled in series are disposed on the first side of the electro-active material.

An interconnect structure comprising:

• a first conductive layer;
• an organic layer disposed on the first conductive layer;
• a second conductive layer;
• an organic layer disposed on the second conductive layer;
• and
• an interconnect layer disposed on the first and second conductive layers, wherein the interconnect layer is configured to electrically couple the first and second conductive layers.

A method of fabricating a device, the method comprising:

• disposing a first interconnect layer on a first substrate;
• disposing a plurality of first electrodes and second electrodes on the first interconnect layer;
• disposing a first electro-active material on the plurality of first and second electrodes;
• disposing a second interconnect layer on a second substrate;
• disposing a plurality of second electrodes and first electrodes on the second interconnect layer;
• disposing a second electro-active material on the plurality of second and first electrodes;
• coupling the first and second substrates to form an assembly;
• and
• curing the assembly.