Electriplast moldable capsule and method of manufacture
AssigneeIntegral Technologies, Inc.
InventorThomas Aisenbrey
Life of this patent
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Abstract
A method to form moldable capsules of a conductively doped resin-based material are created. The method comprises compressing a bundle of micron conductive fiber strands by passing the bundle through a compressing ring. A resin-based material is extruded/pultruded onto the compressed bundle. The resin-based material and the bundle are sectioned into moldable capsules. The micron conductive fiber comprises between about 20% and about 50% of the total weight of each moldable capsule.
Claims31
A method to form a moldable capsule comprising:
- compressing a bundle of micron conductive fiber strands;
- extruding/pultruding a resin-based material onto said compressed bundle;
- and
- sectioning said extruded/pultruded resin-based material and said bundle into moldable capsules.
A method to form a moldable capsule comprising:
- compressing a bundle of micron conductive fiber strands;
- extruding/pultruding a resin-based material onto said compressed bundle;
- and
- sectioning said extruded/pultruded resin-based material and said bundle into moldable capsules wherein said micron conductive fiber comprises between about 20% and about 50% of the total weight of each said moldable capsule.
A method to form a moldable capsule comprising:
- forming a chemically inert coupling agent onto strands of a bundle of micron conductive fiber;
- thereafter compressing said bundle of micron conductive fiber strands by passing said bundle through a compressing ring;
- extruding/pultruding a resin-based material onto said compressed bundle;
- and
- sectioning said extruded/pultruded resin-based material and bundle into moldable capsules.
Dependencies are inferred from the claim text.