Selective slurry for chemical mechanical polishing
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorJinru Bian
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Abstract
An aqueous solution is useful for selective removal in the presence of a low-k dielectric. The aqueous solution comprises by weight percent 0 to 25 oxidizer; 0.00002 to 5 multi-component surfactant, the multi-component surfactant having a hydrophobic tail, a nonionic hydrophilic portion and an anionic hydrophilic portion, the hydrophobic tail having 6 to 30 carbon atoms and the nonionic hydrophilic portion having 10 to 300 carbon atoms; 0 to 15 inhibitor for a nonferrous metal; 0 to 50 abrasive; 0 to 20 complexing agent for a nonferrous metal; and water.
Claims10
An aqueous solution useful for selective removal in the presence of a low-k dielectric comprising by weight percent 0 to 25 oxidizer;
- 0.00002 to 5 multi-component surfactant, the multi-component surfactant having a hydrophobic tail, a nonionic hydrophilic portion and an anionic hydrophilic portion, the hydrophobic tail having 6 to 30 carbon atoms and the nonionic hydrophilic portion having 10 to 300 carbon atoms;
- 0 to 15 inhibitor for a nonferrous metal;
- 0 to 50 abrasive;
- 0 to 20 complexing agent for a nonferrous metal;
- and water.
An aqueous solution useful for selective removal in the presence of a low-k dielectric comprising by weight percent 0 to 20 oxidizer;
- 0.00005 to 2 multi-component surfactant, the multi-component surfactant having a hydrophobic tail, a nonionic hydrophilic portion and an anionic hydrophilic portion, the hydrophobic tail having 8 to 20 carbon atoms and the nonionic hydrophilic portion having 20 to 200 carbon atoms;
- 0.001 to 15 inhibitor for a nonferrous metal;
- 0 to 40 abrasive;
- 0 to 10 complexing agent for a nonferrous metal;
- and water.
A method of removing at least a portion a layer from a semiconductor substrate comprising the step of polishing the semiconductor substrate with a polishing solution, the solution comprising by weight percent 0 to 25 oxidizer;
- 0.00002 to 5 multi-component surfactant, the multi-component surfactant having a hydrophobic tail, a nonionic hydrophilic portion and an anionic hydrophilic portion, the hydrophobic tail having 6 to 30 carbon atoms and the nonionic hydrophilic portion having 10 to 300 carbon atoms;
- 0 to 15 inhibitor for a nonferrous metal;
- 0 to 50 abrasive;
- 0 to 20 complexing agent for a nonferrous metal;
- and water.
Dependencies are inferred from the claim text.