Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsTakehiko Orii, Tatsuya Nishida, Osamu Kuroda
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Abstract
A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.
Claims21
1-21. (canceled)
A substrate processing method comprising:
- rotating a substrate;
- and
- supplying an inert fluid to the substrate, and thereafter supplying a chemical liquid to a position of the substrate radially outside a portion of the substrate to which the inert fluid is supplied, while supplying the inert fluid to the substrate.
A substrate processing method comprising:
- treating a back surface of a substrate with a liquid;
- and
- thereafter treating at least a peripheral part of the substrate with a liquid, by supplying an inert fluid to the substrate, and thereafter supplying a chemical liquid to a position of the substrate radially outside a portion of the substrate to which the inert fluid is supplied, while supplying the inert fluid to the substrate.
Dependencies are inferred from the claim text.