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US 2006/0130966 A1Published application
Method and system for flowing a supercritical fluid in a high pressure processing system
OwnerDarko Babic, Eric Stranginventors
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Abstract
A method and system is described for treating a substrate with a supercritical fluid using a high temperature process. For example, when the supercritical fluid includes carbon dioxide in a supercritical state, the high temperature process is performed at a temperature approximately equal to and exceeding 80 degrees C., which is greater than the critical temperature of approximately 31 degrees C.
Claims20
A processing system for treating a substrate comprising:
- a processing chamber configured to treat said substrate;
- a platen coupled to said processing chamber, and configured to support said substrate beneath a ceiling of said processing chamber;
- a fluid supply system coupled to said processing chamber, and configured to introduce a high pressure fluid to said processing chamber;
- a fluid flow system coupled to said fluid supply system, and configured to flow said high pressure fluid through said processing chamber over said substrate;
- one or more inlets coupled to said fluid flow system, and configured to introduce said high pressure fluid to said processing chamber through said ceiling and into a space between said ceiling and said substrate at a substantially center portion of said substrate;
- and
- one or more outlets positioned beyond a peripheral edge of said substrate, and configured to discharge said high pressure fluid from said space,
- wherein a height between said ceiling and an upper surface of said substrate monotonically decreases with radial position across said substrate from said substantially center portion of said substrate to said peripheral edge of said substrate.
5 more elements
Dependencies are inferred from the claim text.